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Discover detailed guidance on occupational safety in microphone manufacturing! This document provides important information to help protect workers’ health and optimize the production process, ensuring a safe and effective work environment.

Table of Contents

PART I: CURRENT STATE OF SAFETY WORK IN THE MICROPHONE MANUFACTURING INDUSTRY

I. General Situation

The Ministry of Labour, Invalids and Social Affairs informs sectors and localities of the occupational accident situation in the first 6 months of 2024 and outlines key solutions to proactively prevent incidents and accidents in the last 6 months of 2024. According to reports from 61 out of 63 centrally governed provinces and cities, in the first 6 months of 2024, there were a total of 3,201 occupational accidents nationwide (a decrease of 227 cases, equivalent to 7.09% compared to the same period in 2023), resulting in 3,065 victims (a decrease of 197 people, equivalent to 6.04% compared to the first 6 months of 2023), including both employees under labor contracts and those working without labor contracts. Specifically:

Number of fatal occupational accidents: 320 cases, a decrease of 25 cases (7.25%) compared to the first 6 months of 2023 (including 245 cases in areas with labor relations, a decrease of 28 cases or 10.3%; and 75 cases in areas without labor contracts, an increase of 3 cases or 4.2% compared to the first 6 months of 2023);
Number of deaths due to occupational accidents: 346 people, a decrease of 7 people or 1.98% compared to the same period in 2023 (including 268 in areas with labor relations, a decrease of 13 people or 4.63%; and 78 in areas without labor contracts, an increase of 6 people or 8.33%).
Number of people seriously injured: 810 people, an increase of 26 people or 3.32% compared to the first 6 months of 2023 (including 710 in areas with labor relations, a decrease of 5 people or 0.7%; and 100 in areas without labor contracts, an increase of 31 people or 44.92%).

Download the PDF file Occupational Accident Report – First 6 Months of 2024 issued by the Ministry of Labour, Invalids and Social Affairs.

The occupational accident situation in the first 6 months of 2024 in both sectors with and without labor relations saw a decrease in the number of deaths and fatal accidents compared to the same period in 2023.

II. Some Occupational Accidents in Microphone Manufacturing Plants

In the microphone manufacturing industry, ensuring occupational safety is crucial to avoid unwanted accidents. Below are some common accidents that can occur in microphone manufacturing plants:

Risk of burns from heating equipment: During production, heating equipment such as furnaces and dryers can cause burns to workers if not properly maintained or if appropriate protective equipment is not used.
Accidents due to chemical exposure: The use of chemicals in microphone production can lead to health problems such as skin allergies, eye irritation, or respiratory issues if proper protective and personal hygiene measures are not taken.
Mechanical injuries from machinery: Machinery and equipment on the production line can cause serious injuries if not regularly inspected and maintained or if workers do not follow safety rules when working.
Risk from dust exposure: Dust from raw materials and the production process can cause respiratory or irritation problems if there is no adequate ventilation system and personal protective equipment.

To minimize these risks, microphone manufacturing plants need to apply strict occupational safety measures, including employee training, use of protective equipment, and implementation of regular maintenance and inspection procedures.

PART II: OCCUPATIONAL SAFETY AND HEALTH WHEN WORKING IN A MICROPHONE MANUFACTURING PLANT

I. Occupational Safety and Health for Wafer Fabrication Staff

1. Characteristics of Wafer Fabrication Work

Wafer fabrication is a crucial stage in microphone production, where silicon is processed to create thin wafers that serve as the foundation for the entire manufacturing process. The process begins with the selection and processing of raw silicon, which is then melted and purified to remove impurities. The pure silicon is cast into large cylinders, which are then sliced into thin discs called wafers. These wafers have a uniform thickness and a smooth, flat surface, meeting strict technical requirements.

The wafer fabrication process requires high precision and strict quality control to ensure each wafer meets standards for thickness and purity. The wafer surface must be treated to remove any defects, preparing it for the next steps in microchip production. This is a foundational stage that determines the quality and performance of the microprocessors in microphone products, so any errors in this phase can affect the efficiency of the final product.

2. Types of Occupational Accidents during Wafer Fabrication

During the wafer fabrication process, several types of occupational accidents can occur due to the nature of the work and the equipment used. First, the risk of burns from high temperatures is a serious issue because processing silicon requires extremely high temperatures. Workers can suffer burns if they come into direct contact with heating equipment or hot solutions without adequate protection.

Second, the use of chemicals in the fabrication process also poses a risk of exposure to hazardous substances, causing skin, eye, or respiratory irritation. These chemicals are often used to clean and treat the wafer surface, and if safety measures are not followed, they can cause serious health problems.

In addition, mechanical accidents from wafer cutting and grinding equipment are also a risk. This machinery can cause injuries if not properly maintained or if workers do not follow safety rules when working. To minimize these risks, adhering to safety procedures, using personal protective equipment, and performing regular equipment maintenance are very important.

3. Causes of Occupational Accidents during Wafer Fabrication

Occupational accidents during the wafer fabrication process primarily stem from causes related to equipment, chemicals, and work procedures. One of the main causes is a lack of equipment maintenance and inspection. The machinery used in wafer fabrication, such as furnaces and cutting machines, requires regular maintenance to ensure safe operation. If the equipment is not properly maintained, it can lead to technical failures, causing accidents for workers.

In addition, exposure to hazardous chemicals during the silicon processing is also a significant cause. Chemicals used to clean and treat wafers can cause skin irritation and other health problems if adequate protective measures are not in place. The lack of personal protective equipment or non-compliance with safety procedures when using chemicals can increase the risk of accidents.

Finally, a lack of training and supervision of workers also contributes to an increase in occupational accidents. Workers need to be fully trained on safety procedures and how to use equipment to minimize risks. A lack of training can lead to non-compliance with safety measures, increasing the risk of accidents during the wafer fabrication process.

4. Preventive Measures for Occupational Accidents during Wafer Fabrication

To prevent occupational accidents during the wafer fabrication process, applying preventive measures is extremely important. First, workers need to be thoroughly trained on safety procedures and the correct way to use equipment. Adequate training helps employees identify potential hazards and take necessary protective measures, minimizing the risk of accidents.

Regular maintenance and inspection of equipment are also a crucial factor. Machinery such as furnaces and cutting machines need to be regularly maintained to ensure stable and safe operation. Prompt detection and repair of technical failures help prevent incidents that may occur during work.

In addition, the use of personal protective equipment is mandatory. Workers should wear safety glasses, chemical-resistant gloves, and protective clothing when in contact with chemicals and hot equipment. An effective ventilation system also needs to be maintained to minimize exposure to dust and toxic chemical vapors.

Finally, establishing safe work procedures and conducting regular inspections and supervision helps ensure that all safety measures are followed. By combining training, equipment maintenance, and the use of protective equipment, the risk of occupational accidents during the wafer fabrication process can be significantly reduced.

5. Occupational Safety Regulations for Wafer Fabrication

During the wafer fabrication process, adhering to occupational safety regulations is crucial to protect workers’ health and ensure the production process runs smoothly. First, all workers must be fully trained on the work process and safety measures related to handling silicon and thermal equipment. The training process should include identifying potential hazards, how to use personal protective equipment, and timely incident response.

Equipment and machinery must be regularly inspected and maintained according to regulations to ensure they operate effectively and safely. Workers also need to comply with personal protection regulations, including wearing chemical-resistant gloves, safety glasses, and protective clothing when exposed to hazardous chemicals and hot equipment.

In addition, the chemical handling process must be carried out according to strict safety guidelines, with an effective ventilation system to minimize exposure to dust and toxic vapors. Workplace hygiene regulations must also be implemented to ensure the work environment is always clean and safe.

Finally, establishing incident response procedures and conducting regular safety inspections are necessary to ensure all safety regulations are followed. By strictly implementing these regulations, the factory can minimize the risk of occupational accidents and maintain a safe working environment for all employees.

6. Handling Emergency Occupational Accident Situations during Wafer Fabrication

When an occupational accident occurs during the wafer fabrication process, handling the emergency situation quickly and effectively is extremely important to minimize damage and ensure the safety of workers. First, as soon as an accident occurs, the emergency department and the factory’s medical staff must be notified immediately. At the same time, surrounding workers should be asked to leave the accident area to avoid increasing risks and to facilitate incident handling.

Next, if someone is injured, basic first aid measures should be taken quickly. For example, in the case of a burn, the burn should be cooled with cool water and the affected area protected from dirt. If there is a chemical leak, a chemical spill kit should be used quickly to clean the area and prevent further contact.

At the same time, it is very important to record the details of the accident to investigate the cause and implement preventive measures in the future. Finally, incident review meetings should be held to learn from the experience and adjust occupational safety procedures to prevent similar accidents from happening in the future.

Handling an emergency occupational accident not only requires a quick response but also coordinated cooperation between departments and adherence to established safety procedures.

II. Occupational Safety and Health for Photolithography Staff

1. Characteristics of Photolithography Work

The work of photolithography is a crucial step in the wafer fabrication process, where circuit patterns are transferred onto the wafer surface using lithography technology. In this stage, the microcircuit designs are converted into precise and detailed images, which are then printed onto the silicon wafer surface through a series of complex processes.

The process begins by applying a light-sensitive layer (photoresist) onto the wafer surface. This layer is then exposed to light through a mask containing the image of the circuit patterns. The light will either harden or soften the photoresist layer, depending on the type of photoresist used. After exposure, the wafer is washed to remove the unnecessary photoresist parts, leaving the required circuit patterns on the surface.

Photolithography work requires high precision, because any small error in this process can lead to failures in the subsequent microcircuits. Factors such as the quality of the mask, the precision of the light exposure, and the uniformity of the photoresist layer all affect the final result. Therefore, workers must work in a strictly quality-controlled environment and use modern equipment to ensure that the circuit patterns are printed according to technical requirements.

2. Types of Occupational Accidents during Photolithography

During the photolithography process for fabricating microcircuits on wafers, several types of occupational accidents can occur due to the complexity of the technology and the work environment. One of the main risks is exposure to hazardous chemicals. In the photolithography process, light-sensitive substances and solvents are often used to process the wafer. Without appropriate protective measures, workers can suffer from skin, eye, or respiratory tract irritation due to direct contact with these chemicals.

In addition, working with exposure equipment and printers can lead to mechanical accidents. This equipment often operates at high pressure and high temperatures, and if not properly maintained, it can cause injuries to workers, such as burns or cuts.

It is also necessary to be aware of the risk of incidents related to the work environment. In a cleanroom, where the photolithography process is usually performed, dust and impurities need to be strictly controlled. If hygiene and safety regulations are not followed, it can lead to failures in the printing process, affecting the quality of the microcircuits and posing a potential accident risk for workers.

These accidents can be minimized by strictly adhering to safety procedures, using personal protective equipment, and performing regular equipment maintenance to ensure a safe and efficient work environment.

3. Causes of Occupational Accidents during Photolithography

Occupational accidents during the photolithography process for fabricating microcircuits on wafers often stem from several main causes. First, exposure to hazardous chemicals is a major risk. Chemicals such as photoresist and solvents commonly used in this process can cause irritation or injury if not used correctly. A lack of personal protection and ineffective ventilation increase the risk of exposure to these hazardous substances.

Second, incidents related to printing equipment are also a major cause of accidents. The printer and exposure system need to operate precisely to ensure print quality. However, if the equipment is not regularly maintained or experiences a technical failure, it can lead to mechanical accidents, such as burns from heat or other injuries.

Finally, a work environment that is not strictly controlled also contributes to the risk of accidents. In a cleanroom, the presence of dust and impurities can damage the photolithography process and increase risks for workers. A lack of maintaining the cleanliness of the work environment can lead to unforeseen incidents and affect occupational safety.

Identifying and controlling these causes is very important to ensure a safe work environment and minimize the risk of accidents during the photolithography process.

4. Preventive Measures for Occupational Accidents during Photolithography

To prevent occupational accidents during the process of printing microcircuits on wafers, implementing preventive measures is very important. First, it is necessary to train workers on the work process and safety. Workers need to understand how to use chemicals and equipment correctly, as well as personal protection measures to minimize the risk of exposure to hazardous substances.

Using personal protective equipment is another important measure. Workers should wear safety glasses, chemical-resistant gloves, and masks when working with chemicals and high-temperature equipment. Ensuring that the ventilation system operates effectively in the cleanroom also helps to minimize exposure to dust and harmful vapors.

Regular maintenance and inspection of printing equipment and the lighting system are necessary to ensure stable and safe operation. This equipment needs to be checked regularly to detect and promptly repair any failures, preventing incidents that may occur during work.

Finally, maintaining a clean work environment and adhering to hygiene regulations is very important. Controlling dust and impurities in the cleanroom helps to ensure the printing process is accurate and safe. By implementing these measures, the risk of occupational accidents can be minimized, and a safe work environment for all workers can be ensured.

5. Occupational Safety Regulations for Photolithography

When performing photolithography on wafers to create microcircuits, adhering to occupational safety regulations is crucial to protect health and ensure the production process runs smoothly. First, workers must be fully trained on the photolithography process and related safety measures. This training includes identifying potential hazards, how to use chemicals safely, and incident response procedures.

Regulations on personal protective equipment must also be strictly followed. Workers must wear safety glasses, chemical-resistant gloves, and masks when working with hazardous chemicals and high-temperature equipment. Ensure that all protective equipment is inspected and replaced when necessary to maintain its protective effectiveness.

The ventilation system in the cleanroom must also be maintained according to specified standards. This helps to minimize exposure to dust and harmful vapors, protecting workers’ health and ensuring product quality.

At the same time, regulations on equipment maintenance and inspection must be carried out regularly. Equipment such as printers and lighting systems need to be periodically inspected and maintained to detect and promptly fix technical problems.

Finally, implementing regulations on workplace hygiene is mandatory. Ensuring a clean and tidy work environment not only helps to improve work efficiency but also minimizes the risk of accidents. Adhering to these occupational safety regulations is necessary to protect workers’ health and maintain a safe work environment.

6. Handling Emergency Occupational Accident Situations during Photolithography

When an occupational accident occurs during the photolithography process on a wafer, emergency handling is necessary to minimize injury and ensure worker safety. As soon as an incident occurs, the first step is to immediately notify the emergency department and the factory’s medical staff. This helps to ensure that necessary medical measures are deployed quickly.

If a worker is exposed to chemicals, the victim should first be quickly moved out of the hazardous area. In case of chemical contact, the affected area should be washed with clean water for at least 15 minutes and contaminated clothing removed. For burns or wounds, basic first aid should be performed, such as cooling the burn with cool water and bandaging the wound if necessary.

At the same time, incidents related to equipment must be controlled and handled. Disconnect the power and lock the damaged equipment to prevent the risk of subsequent accidents. This helps protect other workers and prevent the spread of the incident.

After the emergency situation is handled, an investigation should be conducted to determine the cause of the accident and to learn from the experience. This helps to update and improve occupational safety procedures, preventing similar accidents from occurring in the future. The process of evaluating and updating safety measures is very important to maintain a safe and effective work environment.

III. Occupational Safety and Health for Chemical Processing Staff

1. Characteristics of Chemical Processing Work

Chemical processing work in the fabrication of microcircuits on wafers requires high precision and sophisticated techniques. This is a crucial step in applying and processing chemical layers to create microstructures on the silicon wafer surface. This process begins with coating a light-sensitive chemical layer onto the wafer surface. This chemical, usually a photoresist, will react with light to form the circuit pattern layers.

After the chemical layer is coated, the wafer is exposed to light through a mask with the microcircuit design pattern. The light will change the properties of the photoresist layer, allowing the microcircuit patterns to be formed after washing. The subsequent steps include chemical processing to create the precise microstructures as required by the design.

This process needs to be performed in a highly controlled quality environment, such as a cleanroom, to avoid dust and impurities that could damage the microstructures. Workers must use personal protective equipment and adhere to safety regulations when working with hazardous chemicals. Ensuring a precise and safe chemical processing procedure is crucial to achieve the highest quality microcircuit product and to protect the health of the workers.

2. Types of Occupational Accidents during Chemical Processing

During the chemical processing to create microstructures on wafers, several types of occupational accidents can occur due to the specific nature of the work and the work environment. One of the main risks is exposure to hazardous chemicals. Light-sensitive chemicals, solvents, and other processing agents can cause skin, eye, or respiratory system irritation if not properly protected. Uncontrolled contact with these chemicals can lead to severe symptoms or long-term damage.

Mechanical accidents are also a concern in this process. The use and operation of chemical processing equipment, such as coating machines and light exposure machines, can lead to injuries if the equipment malfunctions or is not properly maintained. These accidents can include burns from heat, cuts, or trips and falls due to improperly installed and maintained equipment.

Besides, in a cleanroom environment, the risk of poisoning or infection can also occur if hygiene and environmental quality control are not strictly maintained. Dust or impurities can damage the chemical processing procedure, leading to incidents and posing a potential risk to workers.

These accidents can be minimized by strictly adhering to safety regulations, using adequate personal protective equipment, and performing regular equipment maintenance to ensure a safe and effective work environment.

3. Causes of Occupational Accidents during Chemical Processing

Occupational accidents during the chemical processing to create microstructures on wafers often stem from several main causes. First, exposure to hazardous chemicals is a common cause. Chemicals such as photoresist and solvents can cause skin, eye, and respiratory irritation if not handled properly or if personal protection is inadequate. Direct contact with these chemicals, especially without protective equipment or insufficient ventilation, can lead to serious incidents.

Second, incidents during equipment operation are a significant cause. Chemical processing equipment such as coating machines and light exposure machines must be regularly maintained and inspected to ensure normal operation. When equipment malfunctions or is not properly maintained, it can cause accidents such as thermal burns, cuts, or other equipment-related injuries.

In addition, a lack of maintaining a clean work environment and quality control also contributes to accidents. Dust and impurities in the cleanroom can damage the chemical processing and pose a potential risk to workers.

Finally, a lack of training and safety awareness can also lead to accidents. Workers who are not fully equipped with the knowledge of how to handle chemicals and equipment may encounter unforeseen dangerous situations. Inadequate training increases the risk of accidents and affects occupational safety.

4. Preventive Measures for Occupational Accidents during Chemical Processing

To prevent occupational accidents during the chemical processing, implementing preventive measures is very important. First, workers need to be fully trained on the chemical processing procedure and related safety measures. This helps them understand how to use chemicals and equipment safely, as well as to identify and respond promptly to emergency situations.

Using personal protective equipment is an essential measure. Workers should wear safety glasses, chemical-resistant gloves, and masks when working with hazardous chemicals. This helps to minimize direct contact with chemicals and protect the health of workers.

Ensuring that the ventilation system in the cleanroom operates effectively is also an important factor. The ventilation system helps to remove dust and harmful vapors, reducing the risk of exposure to hazardous chemicals. At the same time, chemical processing equipment needs to be regularly maintained and inspected to ensure stable and safe operation.

In addition, maintaining a clean and tidy work environment also contributes to accident prevention. Dust and impurities can affect the chemical processing procedure and increase the risk of accidents. By implementing these measures, risks can be minimized, and a safe work environment for all workers can be ensured.

5. Occupational Safety Regulations for Chemical Processing

When processing chemicals to create microstructures on wafers, adherence to occupational safety regulations is extremely important to protect the health and safety of workers. First, all workers must be fully trained on work procedures, how to handle chemicals, and emergency response measures. This training helps them identify potential hazards and understand how to protect themselves and their colleagues.

It is mandatory to use full personal protective equipment such as gloves, safety glasses, masks, and chemical-resistant clothing when working with chemical products. This helps to minimize the risk of direct contact with hazardous chemicals. Furthermore, work areas must be equipped with effective ventilation systems to remove dust and chemical vapors, ensuring the work environment is always well-ventilated.

All chemicals and equipment must be stored and used according to the manufacturer’s instructions. Regulations on chemical storage, including storing in appropriate and clearly labeled containers, must be strictly followed. At the same time, workers should have regular health check-ups to detect early signs of effects from chemicals.

Finally, work procedures must be fully documented, and incidents must be reported immediately so that they can be investigated and safety procedures improved. Full implementation of these regulations not only helps protect the health of workers but also ensures product quality and safety for the entire production process.

Take tests at occupational safety centers to obtain an occupational safety certificate. This will ensure that workers grasp safety knowledge and have valid certification for employment.

6. Handling Emergency Occupational Accident Situations during Chemical Processing

In the event of an occupational accident during chemical processing, a quick and accurate response is crucial to minimize harm and ensure safety. When a chemical-related incident occurs, the first step is to quickly identify the type of chemical and the level of exposure. If there are signs of chemical exposure, the worker should immediately leave the contaminated area and move to a safe place.

For cases of chemical contact with the skin, the exposed area should be immediately washed with clean water and soap for at least 15 minutes. In case of chemical splashing into the eyes, the eyes must be rinsed with clean water or an eyewash solution for at least 15 minutes, while seeking immediate medical help. If there are signs of inhaling harmful chemical vapors, the worker should move to a well-ventilated area and breathe fresh air.

Immediately after an accident, the company’s emergency department should be notified, and the incident details recorded. Timely and complete reporting helps the medical team and management to intervene quickly and investigate the cause of the incident. At the same time, additional preventive measures should be implemented, and safety procedures updated to prevent similar incidents in the future.

Finally, handling an accident not only includes timely rescue measures but also requires review and evaluation to improve work processes, retrain employees, and enhance safety measures in the future.

IV. Occupational Safety and Health for Wafer Dicing Staff

1. Characteristics of Wafer Dicing Work

Wafer dicing is a crucial stage in the microcircuit production process, where silicon wafers are divided into small microcircuits, also known as dies, according to the required dimensions. In this process, the wafers that have been processed and patterned with electrical circuits are cut into smaller parts for use in electronic devices.

The wafer dicing process typically uses specialized dicing machines with ultra-thin and precise cutting blades, which help ensure that the microcircuits are not damaged and retain the necessary electronic properties. The dicing machine must be regularly calibrated and maintained to ensure high cutting quality and minimize risks related to equipment failure.

The specific nature of this work requires extremely high precision, as any error in the cutting process can lead to circuit loss or reduce the performance of the final electronic devices. Therefore, workers must regularly check and verify the dimensions of the microcircuits after cutting to ensure they meet technical standards.

Wafer dicing work also requires a clean work environment and good control of dust to avoid affecting the quality of the microcircuits. Employees working in this field must strictly adhere to safety regulations to protect themselves and ensure product quality.

2. Types of Occupational Accidents during Wafer Dicing

During the process of dicing wafers to create small microcircuits, several types of occupational accidents can occur. One of the common accidents is injury from the cutting blade. Wafer dicing machines use ultra-thin and sharp cutting blades, which can cause serious cuts or scratches if not used correctly or if the equipment malfunctions. In particular, when workers are not paying attention or are careless, they can be stabbed by the cutting blade in the hand or other parts of the body.

Accidents from dust and debris are also a serious issue. During the cutting process, silicon dust and small debris can be dispersed and cause irritation or damage to the respiratory tract and eyes. If the ventilation system is not effective or workers do not wear appropriate protection, the risk of health effects will be higher.

Equipment-related incidents are another type of accident. Dicing machines, if not properly maintained, can malfunction, leading to sudden failures or breakdowns. This can be dangerous for the operator if the equipment is not regularly inspected and maintained.

Finally, accidents can occur due to errors in the work process or a lack of training. If workers are not equipped with sufficient skills and knowledge on how to operate the equipment safely, or if the dicing process is not performed correctly, the risk of accidents will increase.

3. Causes of Occupational Accidents during Wafer Dicing

Occupational accidents during the wafer dicing process often stem from several main causes. An important cause is a lack of equipment maintenance and inspection. Wafer dicing machines, if not regularly maintained and periodically inspected, can experience technical failures or wear and tear, leading to inaccurate cutting or causing accidents.

Non-compliance with safety procedures is also a major cause. Workers may be at risk when they do not use adequate personal protective equipment such as gloves or safety glasses, or when they do not comply with regulations on occupational safety during machine operation. A lack of attention to performing the work process correctly can lead to serious accidents.

In addition, a lack of training and guidance for workers also contributes to the risk of accidents. Workers who are not equipped with the necessary knowledge and skills to operate the dicing machine safely may make errors during work. A lack of understanding of potential hazards and how to prevent accidents can increase the risk of incidents.

Finally, the presence of dust and debris from the cutting process is also a hazardous factor. If the ventilation system is not effective or workers do not take appropriate protective measures, dust and debris can cause irritation to the eyes and respiratory tract, increasing the risk of occupational accidents.

4. Preventive Measures for Occupational Accidents during Wafer Dicing

To prevent occupational accidents during the wafer dicing process, applying safety measures is very important. First, regular maintenance and inspection of equipment are essential factors. Dicing machines must be regularly maintained to ensure stable and effective operation, and to detect early signs of damage that could be dangerous.

The proper use of personal protective equipment is also an important measure. Workers need to wear appropriate gloves, safety glasses, and masks to protect themselves from the risks of injury from sharp cutting blades and dust debris generated during the cutting process.

Thorough training and guidance for workers are necessary to ensure they understand and comply with occupational safety procedures. Workers should be trained on how to use the equipment correctly, identify potential hazards, and how to respond in case of an incident.

The ventilation system also needs to be inspected and maintained to operate well to minimize dust and debris in the air. This helps protect workers’ health and reduces the risk of eye and respiratory irritation.

Finally, planning and implementing a safe work process is very important. Procedures must be designed to minimize risks as much as possible and to ensure that workers can perform their jobs safely and effectively.

Complete the occupational safety training to be issued an occupational safety card by the occupational safety training center to complete the required documentation for work.

5. Occupational Safety Regulations for Wafer Dicing

Occupational safety regulations during the wafer dicing process play a crucial role in ensuring a safe work environment and minimizing the risk of accidents. First, workers must always adhere to the regular maintenance and inspection procedures for the equipment to ensure the machinery operates effectively and without incident. This includes checking the cutting blade, cooling system, and other components of the dicing machine.

Workers must wear full personal protective equipment such as cut-resistant gloves, safety glasses, and masks throughout the work process. This equipment helps protect against injuries from sharp cutting blades and silicon dust that can harm the eyes and respiratory tract.

The ventilation and dust extraction system must operate effectively to control the level of dust and debris in the air. This not only helps protect workers’ health but also maintains the cleanliness of the work area.

Workers must also be fully trained on safety procedures and how to handle emergency situations. This includes mastering how to use the equipment, identifying potential hazards, and response measures in case of an incident.

Finally, implementing safe work processes and strictly adhering to regulations are necessary to maintain a safe work environment, minimize the risk of accidents, and protect the health of workers.

6. Handling Emergency Occupational Accident Situations during Wafer Dicing

When an occupational accident occurs during the wafer dicing process, emergency handling must be carried out quickly and effectively to minimize injury. First, the worker must immediately stop all machine operations to prevent the situation from becoming more serious. This helps to ensure that there are no further risks from the operating equipment.

Next, the injured person should be immediately checked and given medical treatment. If there is a cut or injury, a sterile gauze pad should be used to stop the bleeding and clean the wound, and the injured person should be taken to the nearest medical facility for treatment. In case of respiratory problems due to dust or debris, the victim should be moved out of the contaminated area and provided with fresh air as soon as possible.

The worker should immediately notify the emergency team or the factory’s occupational safety manager for further support and guidance. At the same time, an accident report must be filed according to regulations, recording the details of the incident to analyze the cause and improve preventive measures in the future.

Finally, measures should be taken to clean and restore the work area after the incident to ensure the safety of the remaining workers and to avoid a repeat of a similar accident.

V. Occupational Safety and Health for Die Bonding Staff

1. Characteristics of Die Bonding Work

Die bonding is an important job in the microcircuit production process, involving attaching the fabricated microcircuits to chip carrier frames and connecting them to the bonding pads to complete the product. In this stage, the microcircuit is precisely placed on the surface of the chip carrier frame through methods such as gluing or soldering. This process requires high precision to ensure that the microcircuits are placed in the correct position and are not misaligned.

After the microcircuit is attached, the bonding pads are connected to the contact points on the microcircuit, creating the necessary electrical links for the microcircuit to function correctly. This work is often performed under a microscope to ensure that the connections are made accurately and without any errors.

In addition, workers need to work in a clean environment with controlled humidity to prevent dust or moisture from affecting the quality of the connections. Precision and care in die bonding work are very important, as any error in this process can seriously affect the performance and reliability of the final product.

2. Types of Occupational Accidents during Die Bonding

During the die bonding process, some common occupational accidents can occur due to the specific nature of the work, which requires high precision and working with small and sharp equipment. A common type of accident is injury from sharp tools or soldering equipment. Workers can be cut or burned if they are not careful when using these tools or when exposed to high temperatures from the soldering process.

Accidents from dust or small particles from materials can also cause respiratory problems or skin irritation if adequate protective equipment is not used. Die bonding requires meticulous operation under a microscope, and any negligence in adjusting the equipment can lead to eye strain or neck fatigue from maintaining a working posture for a long time.

In addition, electrical incidents due to improperly maintained equipment can also occur, posing a risk of electric shock or fire. To minimize these risks, implementing preventive measures and adhering to safety regulations are very important during the die bonding process.

3. Causes of Occupational Accidents during Die Bonding

Occupational accidents during the die bonding process often stem from several main causes related to the work environment and operating procedures. One of the main causes is a lack of care when using sharp tools and soldering equipment. Workers can be injured for not following the correct usage procedures or due to an incident during operation, such as being cut by a knife or burned by soldering equipment.

An unclean work environment is also an important cause. Dust or small particles from materials can cause irritation to the respiratory tract and skin if there are no appropriate protective measures such as masks or gloves. Furthermore, working under a microscope requires high concentration and maintaining a correct posture. Fatigue or stress from working for long periods in an uncomfortable position can lead to health problems such as neck pain or eye strain.

Another cause is incidents with equipment or the electrical system. If the equipment is not regularly maintained or is not safe, it can pose a risk of electric shock or fire. Therefore, maintaining the equipment and adhering to safety regulations are very important to prevent occupational accidents during the die bonding process.

4. Preventive Measures for Occupational Accidents during Die Bonding

To prevent occupational accidents during the die bonding process, applying preventive measures is extremely important. First, workers need to be thoroughly trained on safety procedures and how to use equipment correctly. Ensure that all tools and equipment, including cutting tools and soldering equipment, are regularly inspected and maintained to avoid technical failures.

Using personal protective equipment such as cut-resistant gloves, safety glasses, and masks helps protect workers from risks such as cuts, burns, or irritation from dust. In addition, maintaining a clean work environment and controlling humidity helps minimize the accumulation of dust and small particles that can be harmful.

In addition, workers should be encouraged to take proper breaks to reduce stress and fatigue when working under a microscope, and to adjust their working posture to avoid neck and eye pain. Clear work procedures and emergency measures should be established to handle any incidents that may occur in a timely manner. Strict adherence to safety regulations and implementation of preventive measures will help minimize the risk of occupational accidents and ensure the safety of all employees during the die bonding process.

5. Occupational Safety Regulations for Die Bonding

To ensure safety during the die bonding process, occupational safety regulations must be strictly implemented. First, workers must complete occupational safety training, especially in the use of specialized equipment and tools such as soldering equipment and cutting tools. The equipment must be regularly inspected and maintained to ensure it operates correctly and to minimize the risk of failures causing accidents.

The work environment must be kept clean and well-ventilated to minimize dust and small particles that can be harmful. Workers must use full personal protective equipment, including cut-resistant gloves, safety glasses, and masks, to protect themselves from risks such as cuts, burns, or skin irritation.

The regulations also require the establishment of clear emergency procedures to handle incidents such as short circuits or equipment failure. Workers should have a reasonable work and rest schedule to avoid fatigue and maintain a high level of concentration throughout the work process. Implementing these measures not only ensures the safety of workers but also helps improve production efficiency and minimize incidents during the die bonding process.

6. Handling Emergency Occupational Accident Situations during Die Bonding

When an occupational accident occurs during the die bonding process, handling the emergency situation quickly and effectively is very important to minimize the consequences. First, the worker must immediately stop work and notify the person in charge or the on-site medical team to receive timely support. For injuries from cuts or burns, first aid should be administered on the spot by washing the wound with clean water and bandaging it if necessary, and not touching the wound with dirty hands.

If there is an incident related to electricity or equipment failure, the worker should disconnect the power and notify the maintenance department for inspection and repair. In case of a chemical leak or exposure, immediately move to a safe area and wash the exposed area with water. Ensure that items related to the accident, such as damaged equipment or leaked chemicals, are handled correctly according to safety procedures.

Finally, after handling the situation, a detailed incident report should be made, and a meeting organized to analyze the cause and improve safety procedures. This not only helps prevent similar incidents in the future but also enhances the overall safety level in the work environment.